Copper Electrodeposition for Nanofabrication of Electronics Devices (Nanostructure Science and Technology Book 171)
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Product details
| Management number | 233379205 | Release Date | 2026/06/27 | List Price | $24.48 | Model Number | 233379205 | ||
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This book discusses the scientific mechanism of copper electrodeposition and it's wide range of applications. The book will cover everything from the basic fundamentals to practical applications. In addition, the book will also cover important topics such as: • ULSI wiring material based upon copper nanowiring • Printed circuit boards • Stacked semiconductors • Through Silicon Via • Smooth copper foil for Lithium-Ion battery electrodes. This book is ideal for nanotechnologists, industry professionals, and practitioners. Read more
| ASIN | B00GTE8Y2W |
|---|---|
| XRay | Not Enabled |
| ISBN13 | 978-1461491767 |
| Edition | 2014th |
| Language | English |
| File size | 13.7 MB |
| Page Flip | Enabled |
| Publisher | Springer |
| Word Wise | Not Enabled |
| Print length | 491 pages |
| Accessibility | Learn more |
| Screen Reader | Supported |
| Part of series | Nanostructure Science and Technology |
| Publication date | November 20, 2013 |
| Enhanced typesetting | Enabled |
Historical
Electronics
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